Tech-invite   World Map
3GPPspecs     Glossaries     UICC       IETF     RFCs     Groups     SIP     ABNFs       T+       Search     Home
Top        in Index        Prev        Next

TS 102 613 (ETSI SCP)
Smart Cards –
UICC-CLF Interface –
Part 1: Physical and Data Link Layer Characteristics

|   ToC   |   ETSI-search   |

(P) V11.0.0    2012-09    57 p.
(P) V10.0.0    2012-09    57 p.
(P) V9.3.0    2012-09    57 p.
(P) V8.3.0    2012-09    57 p.
(P) V7.10.0    2012-09    57 p.

The present document defines a communication interface between the UICC and a contactless frontend (CLF) in the terminal. This interface allows the card emulation mode independent of the power state of the terminal as well as the reader mode when the terminal is battery powered.

This TS specifies the Single Wire Protocol (SWP). SWP is the interface between the UICC and the CLF. It defines:
  • Layer1: The physical layer which is responsible for activating, maintaining and deactivating the physical link between the UICC and the CLF. It defines electrical (voltage and current levels, timing and coding of voltage and current levels), mechanical (physical contacts) and functional (data rates) specifications. It also defines the initial communication establishment and the end of the connection.
  • Layer 2: The data link layer which is responsible for the physical addressing of the data through frames and Link Protocol Data Units (LPDU). The data link layer is also responsible for error notification, ordered delivery of frames and flow control. This layer can be split into two sub-layers:
    • The Medium Access Control (MAC) layer which manages frames.
    • The Logical Link Control layer which manages LPDUs and is responsible for the error-free exchange of data between nodes. Three different Logical Link Control layers are defined in the present document.


Here        Top        None        None        Next
part:    1     2



1   Scope   PDF-p. 7
2   References
3   Definitions, symbols, abbreviations and coding conventions
3A   Coding conventions   PDF-p. 10
4   Principle of the Single Wire Protocol
5   System architecture   PDF-p. 11      Up
6   Physical characteristics
7   Electrical characteristics   PDF-p. 18
8   Physical transmission layer

Up        Top        ToC