Tech-invite3GPPspecsGlossariesIETFRFCsGroupsSIPABNFsWorld Map



 

Here   Top   Up   Prev   None
1…      5…   6…   8…   8.4…   A…     

 

 

A  The key physical layer parameters for low chip rate TDD optionPDF-p. 138Up
B  Test CasesPDF-p. 140
B.a  Purpose of Annex
B.b  Requirement classification for statistical testing
B.1  Idle Mode
B.2  UTRAN Connected Mode MobilityPDF-p. 152
B.3  Dynamic Channel Allocation
B.4  Timing characteristics
B.5  UE Measurements Procedures
B.6  Measurement Performance RequirementsPDF-p. 161Up
C  Measurement ChannelsPDF-p. 164
D  Propagation conditionsPDF-p. 181
E  Environmental conditionsPDF-p. 182
F  Terminal capabilities (TDD)PDF-p. 184
G  Methods of measurementPDF-p. 185
H  Global in-channel Tx testPDF-p. 187Up
I  Change HistoryPDF-p. 189

Up   Top