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TR 25.834 (RAN6)
UTRA TDD low chip rate option – Radio protocol aspects

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V4.1.0 (Wzip)    2001/03    38 p.

Rapporteur:  Mr. Liu, YanHui
See also:  –

This TR describes the services provided by the physical layer and the layer 2/3 functionality for support of the 1.28 Mcps low chip rate option of UTRA TDD. Based on the protocol structure existing for UTRA TDD / FDD, it is identified which modifications will be required in order to enable the layer 1 characteristics and key features of the low chip rate option.


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1   Scope   Word-p. 6
2   References
3   Definitions and abbreviations
4   Background and Introduction   Word-p. 8
5   Overview of Physical Layer of TDD Low Chip Rate Option
6   Services and Functions of the Physical Layer of 1.28 Mcps TDD   Word-p. 10
7   Model of physical layer of the UE
8   Formats and configurations for L1 data transfer
9   UE Simultaneous Physical Channels combinations   Word-p. 12
10   Measurements provided by the physical layer   Word-p. 15
11   Primitives of the physical layer   Word-p. 16

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